Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A-19531 Model No: AT/SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O-Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE-CA, X/Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT/SM Die Prep Kit is used working surplus. Some items do not include visible part numbers. The physical condition is good, but there are signs of previous use and handling. Sale Details Item Condition: Used Working, 90 Day Warranty Estimated Packed Shipping Dimensions: L x W x H = 14"x14"x14" @ 8 lbs. Shipping Terms: All Domestic and International shipping quotes and/or fees are subject to change due to packaging requirements, custom packing, transport rate fluctuations, and supply chain demands. We will contact you regarding any shipments that require or incur additional after purchase packing fees or rate changes. Only items pictured are included: If a part is not pictured, or mentioned above, then it is not included in the sale. Pictured test equipment is not included or available for sale. For items with multiple quantities: The pictured item is not necessarily the one that will be sent. Serial numbers or country of manufacture may vary. Items are sold with a 90-Day Satisfaction Guarantee Lister 31